Jointly organised by the HKSAR Government, Hong Kong Trade Development Council and Hong Kong Design Centre, BIP Asia Forum brings IP professionals and business leaders from all over the world to discuss the latest developments in the IP world, and to explore business collaboration opportunities. The eighth edition of the Forum was held on 6-7 December 2018 with great success, featuring over 80 prominent speakers sharing their insights and attracted more than 2,600 IP professionals and industry leaders to attend. The 9th edition will return on 5-6 December 2019. Mark your diary now!
As the supporting organisation of the event, members of Automotive Platforms & Application Systems R&D Centre are offered a special two-day pass (including Keynote Luncheon on Thursday, 5th December) for HK$800 per person (original price HK$1,950).
Online Registration: Click here to register*
*To enjoy the special rate, please register with full payment and promotional code “BIP2019SO_021”
For more information, please visit BIP Asia Forum website at www.bipasiaforum.com.
